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Electronic Manufacturing Service
Electronic Manufacturing Service
Electronic Manufacturing Service
Electronic Manufacturing Service
Electronic Manufacturing Service

PCB Assembly

  • Plated Thru-Hole Assembly
  • SMT assembly including BGA Assembly, smallest placement: 0201
  • DIP

 

  1. Through hole board assembly
    Our Thru-hole assembly process allows for your parts to be hand prepped, loaded and inspected on an assembly line after which they are either wave-soldered or hand soldered. All assembled boards then go through final inspection, ensuring the highest quality before delivery to you.

    2. SMT assembly
    We use Juki and Panasonic assembly line for SMT assembly. Our SMT assembly capability is:
  • Component height: 0.2-25 mm
  • Package: 0201
  • Min distance among BGA : 0.25-2.0 mm
  • BGA size: 0.1-0.63 mm
  • QFP Space: 0.35 mm
  • assembly size: (X*Y): 50*30 mm
  • assembly size: (X*Y): 350*550 mm
  • Pick-Placement precision:±0.01 mm
  • Pick-Placement range: QFP, SOP, PLCC, BGA
  • Placement capability: 0805,0603,0402,0201
  • Via in Pad, Blind & Buried Vias capable
  • Rigid, Flex, Rigid flex capable
  • High pin count press fit capable

     SMT capacity per day upto: 3,000,000 point

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